Stress-free lead frame
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United States of America Patent
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Oct 30, 2007
Grant Date -
May 19, 2005
app pub date -
Dec 23, 2004
filing date -
Sep 13, 2000
priority date (Note) -
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Abstract
The present invention relates to a stress-free lead frame (1) for a semiconductor. The stress-free lead frame (1) is provided with a stress-relief means (15) and an interlocking means (16) at the outer periphery. The stress-relief means (15) is capable of accommodating expansion and compression while the interlocking means (16) take care of shock and vibration during handling to thereby eliminate delamination of the lead frame (10).
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