Apparatus for mounting semiconductor chips
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United States of America Patent
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Oct 30, 2007
Grant Date -
May 12, 2005
app pub date -
Nov 10, 2004
filing date -
Nov 11, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An apparatus for mounting semiconductor chips with a transport device that transports the substrates in cycles to a bonding station where a semiconductor chip is deposited comprises a receiving table with a support surface on which the substrates are presented one after the other for transport by the transport device as well as a pusher device with a drive system and a slide for alignment of the substrate on an end stop. In accordance with the invention, the drive system and the slide comprise a first magnet and a second magnet that attract each other, ie, they are magnetically coupled. The drive system is arranged underneath the support surface and moves its magnet back and forth whereby the magnet of the slide is moved with it. One of the two magnets can also be a ferromagnetic body. The drive system is controlled by software.
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