Structures for small form factor LiNbO3 optical modulator
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United States of America Patent
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Oct 23, 2007
Grant Date -
Dec 15, 2005
app pub date -
Jun 12, 2004
filing date -
Jun 12, 2004
priority date (Note) -
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Abstract
Small form factor package structures are disclosed for LiNbO3 optical modulator by reducing the package dimension for minimize the unused free space inside a modulator package. If a first aspect of the invention, the structure of the small form factor package for LiNbO3 optical modulator employs a metal round block having an inner part that is made of zirconia or glass like borosilicate BK7 or Pyrex and the outer part that is made with stainless steel or kovar. The inner and outer parts represent a two-pieces optical fiber assembly that are held together by a resin. In a second aspect of the invention, a surface of the lithium niobate chip is attached to a surface of the metal round block (or a glass block) that results in an angular positioning of the lithium niobate chip inside the optical package, which significantly reduces the mechanical stress induced by different polishing angle of the metal round block as well as the polishing angle of the lithium niobate chip.
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