Micromachined double tuning-fork gyrometer with detection in the plane of the machined wafer
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United States of America Patent
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Oct 23, 2007
Grant Date -
Mar 10, 2005
app pub date -
Aug 31, 2004
filing date -
Sep 9, 2003
priority date (Note) -
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Abstract
The invention relates to a gyrometer based on a vibrating structure, produced by micromachining in a thin planar wafer. It comprises four moving assemblies placed at the vertices of a virtual rectangle, each moving assembly being coupled to two moving assemblies located at neighboring vertices via a coupling structure and comprising an inertial first moving element connected to the coupling structure and intended to vibrate in two orthogonal directions in the plane of the wafer, namely an excitation direction and a detection direction, and a second moving element intended to vibrate in the detection direction and connected, on one side, to the first moving element and, on the other side, to anchoring zones via linking means.
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