Apparatus for mounting semiconductor chips
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Oct 23, 2007
Grant Date -
Jun 5, 2003
app pub date -
Dec 5, 2002
filing date -
Dec 5, 2001
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An apparatus for mounting semiconductor chips has a pick and place system arranged stationary in vertical direction for the picking, transport and placement of a semiconductor chip onto a substrate. The pick and place system comprises a bondhead with a chip gripper deflectable relative to the bondhead. The deflection of the chip gripper takes place by means of a pneumatic drive arranged on the bondhead which has two pressure chambers separated by a piston, whereby the chip gripper is secured to the piston. The pressure p.sub.1 prevailing in the first pressure chamber and the pressure p.sub.2 prevailing in the second pressure chamber are dynamically controlled by means of a regulator controlled valve system. The regulator can be operated in two operating modes. In the first operating mode, the deflection of the chip gripper and/or a variable derived from it is controlled based on the signal delivered by a position encoder which measures the deflection of the chip gripper. In the second operating mode, the pressure p.sub.1 and/or the pressure p.sub.2 and/or the pressure differential p.sub.1-p.sub.2 is controlled.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully