Forming a copper diffusion barrier
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United States of America Patent
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Oct 9, 2007
Grant Date -
May 6, 2004
app pub date -
Oct 31, 2002
filing date -
Oct 31, 2002
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Abstract
Noble metal may be used as a non-oxidizing diffusion barrier to prevent diffusion from copper lines. A diffusion barrier may be formed of a noble metal formed over an adhesion promoting layer or by a noble metal cap over an oxidizable diffusion barrier. The copper lines may also be covered with a noble metal.
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