Electroplating solution for alloys of gold with tin
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United States of America Patent
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Oct 9, 2007
Grant Date -
Nov 25, 2004
app pub date -
May 18, 2004
filing date -
May 21, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to an electroplating solution for providing a deposit of an alloy of gold and tin. This solution includes an aqueous solvent in which gold is present in the form of a solution soluble cyanide complex and tin is present in the form of a solution soluble organotin complex. 2,2'-dipyridyl is present as an additive that allows the codeposition of useful gold-tin alloy compositions at current densities lower than would be possible in its absence, given the concentrations of the individual metallic components in the solution. This additive is generally used at a concentration of 0.1 to 1 grams per liter for imparting significant enhancements in providing gold-tin alloy deposits.
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