Adhesive curing method, curing apparatus, and optical disc lamination apparatus using the curing apparatus

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7279069
APP PUB NO 20040011457A1
SERIAL NO

10217150

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

The object of the present invention is to considerably reduce the amount of heat generated in comparison with a conventional lamp to decrease the thermal effects on an optical disc in an adhesive curing method suitable for curing adhesive supplied between the substrates of a DVD or other optical disc in particular. In the adhesive curing method as claimed in the present invention, an adhesive is cured by irradiating with ultraviolet rays using semiconductor elements that emit ultraviolet rays instead of a lamp. In this case, light-emitting semiconductor elements are used that emit ultraviolet rays having a wavelength within a range in which the transmittance relative to the adhesive before curing is lower than the transmittance relative to the adhesive after curing.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ORIGIN ELECTRIC COMPANY LIMITED18-1 TAKADA 1-CHOME TOSHIMA-KU TOKYO 171-8555

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Hideo Tokyo, JP 434 4833
Nishimura, Hironobu Tokyo, JP 22 215
Shinohara, Shinichi Tokyo, JP 21 144

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation