Method of selecting a binder for a chipsealing process based on its adhesion index
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United States of America Patent
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Oct 9, 2007
Grant Date -
Apr 6, 2006
app pub date -
Aug 25, 2004
filing date -
Aug 25, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of selecting a binder for a chipsealing process is provided. This method includes measuring the Adhesion Index of at least one binder and selecting a binder with a desirable Adhesion Index for the chipsealing process. The selected binder should have an Adhesion Index no greater than about 3.75 when calculated according to the most preferred method of the present invention. Preferably, the selected binder is applied to a surface and then aggregate is applied within the time parameters defined by the Adhesion Index of the binder to form a chipsealed surface. Preferably, substantially all of the aggregate bonds to the binder without the need for compacting the paved surface.
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