Apparatus and method for control, pumping and abatement for vacuum process chambers
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United States of America Patent
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Oct 9, 2007
Grant Date -
Jul 7, 2005
app pub date -
Dec 31, 2003
filing date -
Dec 31, 2003
priority date (Note) -
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Abstract
The present invention is an apparatus and method for controlling pressure, pumping a vacuum and providing abatement for a plurality of vacuum processing chambers. The system may be used in semiconductor manufacture. Multiple vacuum processing chambers are exhausted by turbo pumps into a common abatement chamber, which is maintained at sub-atmospheric pressure by a backing pump. Pressure in the processing chambers is independently controlled. The internal volume of the abatement device provides a buffer that reduces the effect of pressure changes in one processing chamber affecting pressure in the other chambers.
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