Dielectric recording medium, and method of and apparatus for producing the same
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United States of America Patent
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Oct 2, 2007
Grant Date -
May 12, 2005
app pub date -
Dec 1, 2004
filing date -
Mar 26, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The dielectric recording medium is provided with a dielectric material, a conductive thin film, and a substrate. The conductive thin film and the substrate are bonded by a resin adhesive. The dielectric material is constructed of a ferroelectric single crystal having a uniform thickness, and its one surface is used for a recording and/or reproducing surface, on the order of mm on a side and about 5000 .ANG. thick. The conductive thin film, about 1000 to 2000 .ANG. thick, is placed on a surrounding portion and a back surface of the recording and/or reproducing surface of the dielectric material. The substrate is intended to preserve the thin dielectric material and maintain the planarity, and concave portions are formed on the adhesive surface. The concave portions absorb excessive resin adhesive when the dielectric material is bonded onto the substrate, which makes the adhesive surface uniform and flat.
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