Methods for chemically treating a substrate using foam technology
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United States of America Patent
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Sep 25, 2007
Grant Date -
Jun 14, 2007
app pub date -
Jun 12, 2006
filing date -
Jan 28, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to methods and compositions for treating a surface of a substrate by foam technology that includes at least one treatment chemical. The invention more particularly relates to the removal of undesired matter from the surface of substrates with small features, where such undesired matter may comprise organic and inorganic compounds such as particles, films from photoresist material, and traces of any other impurities such as metals deposited during planarization or etching. A method according to the present invention for treating a surface of a substrate comprises generating a foam from a liquid composition, wherein the liquid composition comprises a gas; a surfactant; and at least one component selected from the group consisting of a fluoride, a hydroxylamine, an amine and periodic acid; contacting the foam with the surface of a substrate; and, removing the undesired matter from the surface of the substrate.
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