Dielectric composition for forming dielectric layer for use in circuitized substrates
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United States of America Patent
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Sep 18, 2007
Grant Date -
Oct 13, 2005
app pub date -
Mar 31, 2004
filing date -
Mar 31, 2004
priority date (Note) -
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Abstract
A dielectric composition which forms a dielectric layer usable in circuitized substrates such as PCBs, chip carriers and the like. As such a layer, it includes a cured resin material and a predetermined percentage by weight of particulate fillers, thus not including continuous fibers, semi-continuous fibers or the like as part thereof.
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