Process for producing high-purity epoxy resin and epoxy resin composition
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United States of America Patent
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Sep 11, 2007
Grant Date -
Jun 16, 2005
app pub date -
Feb 16, 2004
filing date -
Feb 17, 2003
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Abstract
A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component with n=0 is not less than 70% and less than 100%, and that reaction is caused to take place at a temperature of 95-150.degree. C. to produce a multi-functional epoxy compound represented by the general formula (II) ##STR00001##
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