Method and apparatus for treating a disc substrate

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 7267790
APP PUB NO 20030102582A1
SERIAL NO

10309464

Stats

ATTORNEY / AGENT: (SPONSORED)

Importance

Loading Importance Indicators... loading....

Abstract

See full text

A molded disc substrate obtained by injection molding is rotated at high speed before the molded disc substrate has solidified, and a gas is also made to flow in an outward radial direction along a bottom surface of the molded disc substrate while the molded disc substrate is rotating, and the rotation is stopped after the molded disc substrate has solidified. Thus, a disc substrate with little warping is obtained in a short time.

Loading the Abstract Image... loading....

First Claim

See full text

Family

Loading Family data... loading....

Patent Owner(s)

Patent OwnerAddress
ORIGIN ELECTRIC COMPANY LIMITED18-1 TAKADA 1-CHOME TOSHIMA-KU TOKYO 171-8555

International Classification(s)

  • [Classification Symbol]
  • [Patents Count]

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Kobayashi, Hideo Tokyo, JP 434 4833
Nakamura, Masahiro Saitama, JP 238 2644
Shinohara, Shinichi Tokyo, JP 21 144
Suzuki, Takayuki Chiba, JP 661 11733

Cited Art Landscape

Load Citation

Patent Citation Ranking

Forward Cite Landscape

Load Citation