Method of making a microstructure using a circuit board
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United States of America Patent
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Sep 11, 2007
Grant Date -
Jan 6, 2005
app pub date -
Sep 26, 2003
filing date -
Jul 4, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making a microstructure includes the steps of providing a circuit board that includes a dielectric layer and a conductor layer formed on the dielectric layer, forming a metal structure on the circuit board such that the metal structure extends through the dielectric layer, and removing at least a portion of the dielectric layer adjacent to the conductor layer and the metal structure to result in the microstructure.
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