Light emitting diode including a cover covering a light emitting diode element
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United States of America Patent
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Sep 4, 2007
Grant Date -
Feb 3, 2005
app pub date -
Jul 29, 2004
filing date -
Jul 31, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
In an LED (Light Emitting Diode) including a cover covering an LED element, the cover is formed using glass having a composition R.sub.nSiO.sub.2-n/2. The glass according to the present invention is low melting point glass with a softening temperature of -40.degree. C. to 300.degree. C., melts at lower temperatures compared to conventional glass, and can safely form the cover without damaging the LED element. Since glass has better moisture shield performance and resistance to light compared to epoxy resins, the cover is formed using glass, and consequently deterioration of the LED element and a phosphor caused by moisture is reduced, deterioration of the cover caused by light is reduced, and changes in color and luminous intensity are restrained.
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