Semiconductor device having adhesion increasing film to prevent peeling
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United States of America Patent
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Aug 14, 2007
Grant Date -
Dec 8, 2005
app pub date -
Jun 1, 2005
filing date -
Jun 2, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device includes at least one semiconductor constructing body provided on one side of a base member, and having a semiconductor substrate and a plurality of external connecting electrodes provided on the semiconductor substrate. An insulating layer is provided on the one side of the base member around the semiconductor constructing body. An adhesion increasing film is formed between the insulating layer, and at least one of the semiconductor constructing body and the base member around the semiconductor constructing body, for preventing peeling between the insulating layer and the at least one of the semiconductor constructing body and base member.
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