Air gap formation
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United States of America Patent
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Aug 14, 2007
Grant Date -
Jul 15, 2004
app pub date -
Sep 13, 2003
filing date -
Sep 13, 2002
priority date (Note) -
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Abstract
A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulation between metal lines in an electronic device such as an electrical interconnect structure. Structures containing air gaps are also provided.
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