Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same
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United States of America Patent
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Aug 7, 2007
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N/A
app pub date -
Jul 28, 2004
filing date -
Jul 28, 2004
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Expired
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Abstract
A circuitized substrate comprised of at least one dielectric material having an electrically conductive pattern thereon. At least part of the pattern is used as the first layer of an organic memory device which further includes at least a second dielectric layer over the pattern and a second pattern aligned with respect to the lower part for achieving several points of contact to thus form the device. The substrate is preferably combined with other dielectric-circuit layered assemblies to form a multilayered substrate on which can be positioned discrete electronic components (e.g., a logic chip) coupled to the internal memory device to work in combination therewith. An electrical assembly capable of using the substrate is also provided, as is an information handling system adapted for using one or more such electrical assemblies as part thereof.
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