Die package for connection to a substrate
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 7, 2007
Grant Date -
Nov 25, 2004
app pub date -
Jun 29, 2004
filing date -
Oct 18, 2000
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A die carrier for holding a die, such as a microdisplay die, may be electrically connected to a substrate by pressing the substrate against flexible, resilient leads of the die carrier. The package includes a housing and a shroud mounted to the housing. The substrate is inserted through a slot in the shroud and, within the shroud, engages against the flexible, resilient leads, thereby establishing an electrical contact.
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