Dual-interface IC card by laminating a plurality of foils and method of same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Aug 7, 2007
Grant Date -
Oct 13, 2005
app pub date -
Feb 13, 2003
filing date -
Dec 6, 2002
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The present invention provides a method for manufacturing IC card by laminating a plurality of foils. The method of the present invention includes steps of putting a COB, a contact electrode of the COB facing downward; laying at least 2 foils having a hole, wherein said COB is inserted in said respective holes of the foils; laying a foil not having a hole on the foils having a hole; and compressing all of the foils.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully