Semiconductor device, method for designing the same and recording medium that can be read by computer in which program for designing semiconductor device is recorded

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United States of America Patent

PATENT NO 7250686
APP PUB NO 20060197212A1
SERIAL NO

11412749

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A semiconductor device of the present invention comprises a first semiconductor chip that includes a first internal circuit and at least one first conductive pad which is provided on its upper surface and is not connected to the first internal circuit, a second semiconductor chip provided on the first semiconductor chip that includes a second internal circuit and at least one second conductive pad which is provided on its upper surface and is connected to the second internal circuit, at least one first connecting member for connecting between the second semiconductor chip provided on the first semiconductor chip, at least one first conductive pad and at least one second conductive pad, and at least one second connecting member led from at least one first conductive.

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Patent Owner(s)

Patent OwnerAddress
MICRO-OPTIMUS TECHNOLOGIES INC600 ANTON BLVD SUITE 1350 COSTA MESA CA 92626

International Classification(s)

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  • 2006 Application Filing Year
  • H01L Class
  • 15239 Applications Filed
  • 10454 Patents Issued To-Date
  • 68.61 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2006200720082009201020112012201320142015201620172018201920200255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Ishiyama, Yasuhiro Shiga, JP 10 76

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Patent Citation Ranking

  • 0 Citation Count
  • H01L Class
  • 0 % this patent is cited more than
  • 18 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges881427821409249163988958313411701 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +0100200300400500600700800900100011001200130014001500

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