Differentially cured materials and process for forming same
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United States of America Patent
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Jul 31, 2007
Grant Date -
May 2, 2002
app pub date -
Aug 10, 2001
filing date -
Aug 18, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A structure includes a layer which includes a first cured portion and a second cured portion which are formed from a same light curable material. The first cured portion is cured to a first amount, and the second cured portion is cured to a second amount. The first amount is sufficiently different than the second amount to result in a visible discontinuity on the surface of the structure.A method for forming a pattern in a radiation curable material includes providing between a radiation source and the radiation curable material, a pattern that can block a portion of the radiation from the radiation source. The material is cured with radiation from the radiation source to form a pattern in the radiation curable material.
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