Substrate processing apparatus
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United States of America Patent
Stats
-
Jul 31, 2007
Grant Date -
Jun 2, 2005
app pub date -
Sep 8, 2004
filing date -
Dec 1, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Substrate processing apparatus for processing holes accurately positioned in an long film, comprising: work supporting devices for supporting the work; clamping devices for clamping the work onto the work supporting devices; first movement devices for moving the work supporting devices in the transferring direction of the work; guiding devices for guiding the work supporting devices; guide supporting devices for supporting these guiding devices; and second movement devices for moving the guide supporting devices in the direction perpendicular to the transferring direction of the work, wherein two pins or holes are disposed on or in each of the guiding devices, holes or pins to engage with the pins or holes are disposed on or in each of the guide supporting devices to combine the guiding devices and guide supporting devices in a grid form, and the holes and pins at four junctions are fitted.
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