Method and apparatus for measuring depth of holes formed on a specimen
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United States of America Patent
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-
Jul 17, 2007
Grant Date -
Aug 25, 2005
app pub date -
Nov 15, 2004
filing date -
Nov 14, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method an apparatus for measuring the depths of many fine holes formed in the surface of a sample by etching. Positional information on a plurality of hole patterns is acquired by scanning, with a stylus, the surface of the sample in which the hole patterns are formed by etching. The depths of the plurality of hole patterns are measured by scanning, with the stylus, bottom faces of the plurality of hole patterns and the surface of the sample in the respective vicinities of the hole patterns on the basis of the positional information that has been acquired. Information on distribution of the depths of the plurality of hole patterns is displayed on a screen on the basis of information on the measured depths of the plurality of hole patterns and the positional information on each of the hole patterns.
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