Printed wiring board and method of manufacturing the same
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United States of America Patent
Stats
-
Jul 17, 2007
Grant Date -
Jun 29, 2006
app pub date -
Aug 25, 2005
filing date -
Dec 24, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention provides a printed wiring board in which there is no positional deviation between a blind via hole and a land and which enables high-density wiring design to be easily achieved. Provided is a method of manufacturing a printed wiring board in which wiring pattern forming layers are connected by a blind via hole, which includes the steps of forming a wiring pattern by etching at least metal foil laminated on a surface of an insulating layer and forming a land having a window portion in a portion where a blind via hole is to be formed; irradiating the window portion with a laser beam having a diameter larger than the diameter of the window portion but smaller than the diameter of the land, thereby making a nonthrough hole for forming the blind via hole; and forming a blind via hole by forming a plating on the nonthrough hole and the land.
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