Surface mount multichip devices
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United States of America Patent
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Jul 10, 2007
Grant Date -
Nov 10, 2005
app pub date -
Jul 18, 2005
filing date -
Jul 10, 2003
priority date (Note) -
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Abstract
A surface mountable multi-chip device is provided which includes first and second lead frames portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
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