Metallized polyimide film and manufacturing method therefor

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United States of America Patent

PATENT NO 7241490
APP PUB NO 20050214551A1
SERIAL NO

11044760

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A metallized polyimide film includes: a polyimide film; an intermediate layer formed in the polyimide film, the intermediate layer extending 20 nm or less from a surface of the polyimide film, and the intermediate layer including at least one element selected from the group consisting of Mo, Cr, Ni, and Si injected into the polyimide film; and a conductive layer that is made of copper or a copper alloy formed on the intermediate layer, wherein the amount of the at least one element injected into the intermediate layer is between 0.3 and 15 mg/m.sup.2.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI SHINDOH CO LTDTOKYO 140-8550

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Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances200520062007200820092010201120122013201420152016201720182019202020210255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Aida, Masayuki Aizuwakamatsu, JP 3 18

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  • 2 Citation Count
  • B32B Class
  • 3.32 % this patent is cited more than
  • 18 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges6510464301959653211510411901 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650700750800850900950100010501100

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