Heating element movement bonding method for semiconductor components
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United States of America Patent
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Jul 3, 2007
Issued Date -
N/A
app pub date -
Feb 7, 2006
filing date -
Mar 15, 2005
priority date (Note) -
Expired
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Abstract
According to an aspect of the present invention, there is provided a bonding method, comprising disposing on a first body a second body with a bump interposed therebetween; and electrically and mechanically bonding the first body and the second body with the bump by passing a heating element between the first body and the second body to melt the bump by the heating element, the heating element being heated to a melting point or more of a material configuring the bump.
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