Method for bonding semiconductor structures together
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United States of America Patent
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Jun 26, 2007
Grant Date -
Dec 9, 2004
app pub date -
Apr 27, 2004
filing date -
Apr 29, 2003
priority date (Note) -
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Abstract
A method for bonding semiconductor structures together is described. The technique includes providing a bonding surface on each of two semiconductor structures, brushing a bonding surface of at least one of the structures to remove contaminants and to activate hydroxyl groups on the bonding surface to enhance hydrophilicity and to facilitate molecular bonding of the structures, and joining the bonding surfaces together by molecular bonding to form a composite structure.
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