Method for detecting and monitoring wafer probing process instability
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United States of America Patent
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Jun 12, 2007
Grant Date -
Jul 6, 2006
app pub date -
Feb 5, 2003
filing date -
Feb 5, 2003
priority date (Note) -
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Abstract
A system and method for detecting and monitoring wafer probe stability including the steps of, probing each die on a wafer, and for each die determining whether the result of the probe is a pass or a fail. If the result of a probe is a fail, re-probing the die and determining whether the re-probe is a pass or a fail. Once all the dies have been probed determining the rate of die re-probes that lead to passes, comparing the rate of passes on re-probes to a pre-determined limit, and if the rate of passes on re-probes is greater than the predetermined limit, assigning the probe status as unstable.
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