Methods of and apparatus for molding structures using sacrificial metal patterns
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 12, 2007
Grant Date -
Dec 25, 2003
app pub date -
May 7, 2003
filing date -
May 7, 2002
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB.TM. formation process), and typically contain features having resolutions within the 1 to 100 .mu.m range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully