Heat dissipating pin structure for mitigation of LED temperature rise
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United States of America Patent
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Jun 5, 2007
Grant Date -
Sep 8, 2005
app pub date -
Feb 11, 2005
filing date -
Feb 13, 2004
priority date (Note) -
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Abstract
A heat-dissipating pin structure for mitigation of LED temperature rise, characterized in that: on metallic foil circuit or foil surfaced of PCB connecting to joining surface of LED chip, on which LED chips or light-emitting diodes of surface-mounting type or light-emitting single tube will be installed, are provided a plurality of small perpendicular through holes, in which are inserted loose-fitted and heat-conductive pins, and ends of these pins are adapted to be riveted perpendicularly or brazed directly to PCB, so that pins inserted in these holes can be fixed vertically on the back surface of PCB. Based on the principle of heat conduction, in the present invention heat generated in LED's propagates and dissipates along metallic circuit or foil surface and by means of above said pins, wherein heat conducts rapidly due to increase in cross-sectional area and radiates rapidly to surrounding atmosphere due to increase in surface area of heat-dissipating pins, thereby effectively achieving rapid dissipation of heat, suppressing temperature rise of LED working environment, ensuring displaying quality of LED, and guaranteeing normal working life of LED.
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