Method for making integrated circuit aluminium panels
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United States of America Patent
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Jun 5, 2007
Grant Date -
Mar 25, 2004
app pub date -
Dec 7, 2001
filing date -
Dec 11, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention relates to an aluminium OSF integrated circuit panel production method comprising surface preparation of two aluminium alloy sheets, deposition on one of the sheets of a weld-proof ink in reserved areas corresponding to the design of the circuit, connection by rolling of the sheets together, and expansion of the channels corresponding to the non-welded areas using a pressurised fluid, wherein one of the sheets is made of 1000 series alloy and the other of an alloy containing iron and manganese and such that Fe+Mn>0.8% (by weight), and preferentially >1, or 1.5%. The iron and manganese alloy is preferentially obtained by continuous casting of strips between two cooled rolls.The invention also relates to a continuous aluminium alloy integrated circuit panel production method.
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