Method of making a semiconductor device using bump material including a liquid
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United States of America Patent
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May 29, 2007
Grant Date -
Oct 27, 2005
app pub date -
Dec 13, 2004
filing date -
Apr 22, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A method of making a semiconductor device by forming bumps on pads of a test piece. The method includes a fastening process of pouring a bump material including a liquid and a plurality of individual pump materials toward a target face of a mask substrate, the mask substrate having a plurality of holding holes, and making bump materials to become fastened to the holding holes; a removing process of removing the individual bump materials remaining on the target face from the target face; and a compression process of compressing the pads of the test piece from the side of the target face of the mask substrate toward the mask substrate so as to bond the individual bump materials onto the pads. By this method, micro bump materials can be accurately attached onto pads on a silicon wafer, or the like, and the size of the mask substrate can be easily increased.
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