Moving magnetic/cathode arrangement and method
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United States of America Patent
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May 29, 2007
Grant Date -
Jul 8, 2004
app pub date -
Jul 22, 2003
filing date -
Jul 22, 2002
priority date (Note) -
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status (Latency Note)
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Abstract
A magnetron sputtering electrode for use with a magnetron sputtering device, wherein the magnetron sputtering electrode comprises a cathode body, a drive unit coupled to the cathode body, a target received by the cathode body, and a closed loop magnet arrangement received within a magnet receiving chamber and coupled to the drive unit. The closed loop magnet arrangement is comprised of a plurality of magnets adapted for motion relative to the target by the drive unit, wherein at least one of the plurality of magnets is a profiled magnet having a contoured top portion. A method of improving target utilization in sputtering applications is also disclosed.
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