Surface mount modular jack
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United States of America Patent
Stats
-
May 29, 2007
Grant Date -
N/A
app pub date -
Jan 25, 1999
filing date -
Jan 25, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
An improved modular telephone-style jack featuring a guidance system positioned on the lower outer wall so that the guidance system maintains the position of the surface mount solder tails of the contacts of the jack in a controlled fashion. The guidance system consists of a series of substantially linear, parallel ridges which extend outward from the outer wall so that the peak of each ridge is in contact with or immediately adjacent the upper surface of a printed circuit board. The peak of each ridge extends along the upper surface of the printed circuit board for a length that is greater than the length of the solder tail to provide alignment of each solder tail with its corresponding solder paste connection area. Each ridge prevents any solder tail from pivoting such that it could accidentally make contact with either neighboring solder tail. Each ridge further prevents the distance separating neighboring contacts from being reduced to such a small distance that solder could bridge across both contacts. This substantially reduces the risk of an electrical short between two separate signal paths which would render the soldered board unusable with a resultant high scrap cost with the loss of all soldered components. The peak of each ridge further serves to prevent migration and wicking of the solder paste for two separate circuits from joining to each other, thereby shorting the electrical connection between the two separate signal paths. This condition would also render the board unusable. The combination of features of the guidance system allows the solder tails to be formed so that no portion of the solder tail extends beyond the rear wall of the jack. This reverse gull wing configuration of the solder tail provides significant protection of the solder tails as a result of being located entirely under the lower wall of the jack so that the solder tails are not exposed to bending or twisting as normally occurs with j type or gull wing type solder tails or with other solder tail types which extend beyond the main rear wall of the jack.

First Claim
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
TYCO ELECTRONICS LOGISTICS AG | AMPERSTRASSE 3 STEINACH/SG CH 93 |
International Classification(s)
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Bogese, Stephen B | Salem, VA | 3 | 33 |
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
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