Lead-free solder, and a lead-free joint
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United States of America Patent
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May 22, 2007
Grant Date -
May 18, 2006
app pub date -
Oct 23, 2003
filing date -
Oct 24, 2002
priority date (Note) -
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Abstract
A solder not containing lead (a lead-free solder) contains zinc and tin, and also contains 5 weight percent or less nickel and 0.5 weight percent or less aluminum with a liquid phase temperature of 260 degrees C. or greater. In addition, a lead-free solder has a liquid phase temperature of 260 degrees C. or greater, and contains 30 to 70 weight percent zinc, 5 weight percent or less nickel, and the remaining weight percent tin. Moreover, a joint is manufactured using these lead-free solders. As a result, a lead-free solder and a lead-free joint having excellent electrical characteristics but not including harmful substances, can be provided.
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