Metallic nanowire interconnections for integrated circuit fabrication
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 15, 2007
Issued Date -
N/A
app pub date -
Mar 24, 2004
filing date -
Mar 11, 2003
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method for fabricating an electrical interconnect between two or more electrical components. A conductive layer is provided on a substarte and a thin, patterned catalyst array is deposited on an exposed surface of the conductive layer. A gas or vapor of a metallic precursor of a metal nanowire (MeNW) is provided around the catalyst array, and MeNWs grow between the conductive layer and the catalyst array. The catalyst array and a portion of each of the MeNWs are removed to provide exposed ends of the MeNWs.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully