Nanopastes for use as patterning compositions

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United States of America Patent

PATENT NO 7217502
SERIAL NO

11444740

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention provides methods of imagewise exposing a thermally sensitive composition formed from a nanopaste comprising inorganic nanoparticles, a carrier, and preferably certain polymeric binders. The composition has been applied to a substrate and treated to improve adhesion. Exposure affects the solubility of exposed portions of the applied and treated layer relative to unexposed portions of the applied layer. The imaged layer is then developed on-press with a fountain solution, lithographic ink, or both, to remove the exposed portions or unexposed portions of the layer to form an image in a printing plate.

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Patent Owner(s)

Patent OwnerAddress
EASTMAN KODAK COMPANY343 STATE STREET PATENT LEGAL STAFF ROCHESTER NY 14650-0208

International Classification(s)

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  • 2006 Application Filing Year
  • G03C Class
  • 659 Applications Filed
  • 138 Patents Issued To-Date
  • 20.95 % Issued To-Date
Click to zoom InYear of Issuance% of Matters IssuedCumulative IssuancesYearly Issuances2006200720082009201020112012201320140255075100

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Huang, Jianbing Trumbull, CT 86 828
Munnelly, Heidi M Windsor, CO 33 328
Ray, Kevin B Fort Collins, CO 58 263

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Patent Citation Ranking

  • 2 Citation Count
  • G03C Class
  • 8.26 % this patent is cited more than
  • 18 Age
Citation count rangeNumber of patents cited in rangeNumber of patents cited in various citation count ranges75599121451815117722601 - 1011 - 2021 - 3031 - 4041 - 5051 - 6061 - 7071 - 8081 - 9091 - 100100 +050100150200250300350400450500550600650

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