Selective wave solder system
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United States of America Patent
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May 8, 2007
Issued Date -
N/A
app pub date -
Sep 30, 2002
filing date -
Sep 30, 2002
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a selective wave solder machine. In particular, it relates to a system for calibrating and adjusting process points to account for variations in machines and circuit boards. Vision systems are used to locate fiducials on the processing modules and the circuit boards. Differences between stored locations for fiducials relating to the circuit board and the processing modules are used to adjust the positions of stored process points to achieve improved performance.
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