Method for manufacturing printed circuit boards
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United States of America Patent
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-
May 8, 2007
Grant Date -
Sep 9, 2004
app pub date -
Mar 1, 2004
filing date -
Mar 5, 2003
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The amount of time required to manufacture double-sided printed circuit boards that contain conductor bridges can be reduced. A method is provided which includes the steps of forming holes which pass through an insulating board and a first conductor layer formed on a first main side of the insulating board, bonding a second conductor layer to a second main side of the insulating board having the holes, forming a third conductor layer on the whole first main side of the insulating board after bonding the second conductor layer, masking preset holes with a plating resist, plating the first conductor and holes in the insulating board, patterning the first conductor layer to form a first conductor pattern, patterning said second conductor layer to form a second conductor pattern, and removing the plating resist and the third conductor layer from an area which is covered with the plating resist.
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