Circuitized substrate with signal wire shielding, electrical assembly utilizing same and method of making
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United States of America Patent
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Apr 24, 2007
Grant Date -
Sep 8, 2005
app pub date -
Mar 3, 2004
filing date -
Jan 30, 2003
priority date (Note) -
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Abstract
A circuitized substrate in which at least one signal line used therein is shielded by a pair of opposingly positioned ground lines which in turn are electrically coupled to a ground plane located beneath the signal and ground lines and separated therefrom by a common interim dielectric layer. An electrical assembly including the circuitized substrate as part thereof and a method of making the circuitized substrate are also included. The substrate may form part of a larger structure such as a PCB, chip carrier or the like.
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