Integrated circuit device, electronic module for chip cards using said device and method for making same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 24, 2007
Grant Date -
N/A
app pub date -
Jan 18, 2000
filing date -
Jan 27, 1999
priority date (Note) -
Expired
status (Latency Note)
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Abstract
This invention relates to an integrated circuit device, in particular for manufacturing smart card electronic units for smart cards. It comprises: an active layer (32) including a semiconductor material within which integrated circuits are formed and having a face (34) provided with a plurality of electrical connection terminals (36) and a second face, wherein said face has a thickness smaller than 100 .mu.m, and a complementary layer (40) having a first face (42) attached to the active face of the active layer, a second face (44) and a side surface (48), wherein said complementary layer includes a plurality of recesses (46), each recess extending through the whole thickness of the complementary layer, and extending from a contact terminal (36) to said side surface (48).
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