Media for use in plating electronic components
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United States of America Patent
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Apr 24, 2007
Grant Date -
N/A
app pub date -
Jun 16, 2003
filing date -
Jul 31, 2002
priority date (Note) -
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Abstract
Improvements in methods for plating metal on substrates are obtained by providing media in the plating solution in sizes that are less than 60% to 80% smaller than the average dimension of the substrates to be plated. It is also advantageous for the substrates and media to be present in the solution at a volume ratio of above 1/1 to about 5/1. Another embodiment of the invention relates to an apparatus for electroplating a metal deposit on electroplatable substrates.
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