High speed optoelectronic subassembly and package for optical devices
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United States of America Patent
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Apr 17, 2007
Grant Date -
Nov 24, 2005
app pub date -
Nov 5, 2003
filing date -
Nov 19, 2002
priority date (Note) -
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Abstract
A high speed optoelectronic subassembly in an optoelectronic package is disclosed that includes a dielectric support having a first electrical trace on a surface thereof and a dielectric member mounted on the surface of the support having a second electrical trace thereon. The support extends laterally a distance greater than the member to form a shelf. A dielectric step is positioned on the shelf abutting an end of the member and a laser is positioned on the shelf adjacent the step so as to be light accessible external to the subassembly. The laser and the step have surfaces equal in height and cooperate to provide a mounting platform. A resistive element is positioned on the mounting platform and electrically connected to the laser, the resistive element and laser being electrically externally accessible through the traces.
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