Hermetically sealed microdevice with getter shield
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United States of America Patent
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Apr 17, 2007
Grant Date -
Mar 23, 2006
app pub date -
Sep 23, 2004
filing date -
Sep 23, 2004
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A microdevice that comprises a device microstructure (38) and vent channel (34) in a wafer (14) that is sandwiched between a substrate (10) and a cap (16). The cap (16) and substrate (10) have recesses (41, 21) around the microstructure (22) to define a cavity. A vent (25) is connected to the vent channel (34) and subsequently to the cavity. The vent (25) is used to evacuate and seal the microstructure (38) in the cavity. A getter layer (32) can be used to maintain the cavity vacuum. An electrical connection can be provided through the vent (25), vent channel (34) and cavity to the getter (32) to electrically ground the getter layer (32).
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