Substrate inspection device and substrate inspecting method
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United States of America Patent
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Apr 10, 2007
Issued Date -
N/A
app pub date -
Jul 15, 2005
filing date -
Feb 19, 2001
priority date (Note) -
Expired
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Abstract
A laser beam irradiation unit irradiates a laser beam on a top surface pattern portion of a wiring to be inspected among plural wirings formed on a substrate, with an intensity high enough to cause laser abrasion or two-photon absorption at the irradiated portion. A D.C. power supply applies, via an ammeter, a predetermined voltage between an electrode portion that traps electrons released from the top surface portion and a contact prove pressed against a bottom surface pattern of the wiring. An open circuit state and a short-circuit state of the wiring are judged using a current value measured in the ammeter. It is thus possible to inspect a wiring for an open circuit and a short-circuit easily without bringing a probe into contact with the lands of wirings on a top surface of the substrate to be inspected.
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