Semiconductor device having stacked semiconductor chips sealed with a resin seal member
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Apr 3, 2007
Grant Date -
Apr 18, 2002
app pub date -
Sep 28, 2001
filing date -
Oct 16, 2000
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The cost of a semiconductor device is to be reduced. An electrical connection between a first semiconductor chip and a second semiconductor chip stacked on the first semiconductor chip is made through an inner lead portion of a lead disposed at a position around the first semiconductor chip and two bonding wires.
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